Ms. Mai Randall Profile

Mai Randall

at IBM Microelectronics Div

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Author

Publications (3)

Proceedings Article | 29 March 2006 Paper

A universal process development methodology for complete removal of residues from 300mm wafer edge bevel

Mai Randall, Michael Linnane, Chris Longstaff, Kenichi Ueda, Tom Winter

Proceedings Volume 6153, 61533C (2006) https://doi.org/10.1117/12.656524

KEYWORDS: Semiconducting wafers, Fermium, Frequency modulation, Inspection, Tolerancing, Photoresist processing, Lithography, Manufacturing, Contamination, Chemistry

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Proceedings Article | 29 March 2006 Paper

Minimizing wafer defectivity during high-temperature baking of organic films in 193nm lithography

Mai Randall, Christopher Longstaff, Kenichi Ueda, Jim Nicholson, Thomas Winter

Proceedings Volume 6153, 61530V (2006) https://doi.org/10.1117/12.656443

KEYWORDS: Semiconducting wafers, Particles, Fermium, Frequency modulation, Contamination, Chemistry, Camera shutters, Optical inspection, 193nm lithography, Process engineering

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Proceedings Article | 24 May 2004 Paper

Barometric pressure compensation to control photoresist film thickness

Vandana Vishnu, Mai Randall, Carole Pillette, Kyoshige Katayama, Kazuhisa Omura, Ryoichi Uemura, Hiroshi Tomita, Ryoji Ando, Kunie Ogata, Hiromitsu Maejima, Anthony DiDonato, Jim Nicholson

Proceedings Volume 5375, (2004) https://doi.org/10.1117/12.535113

KEYWORDS: Photoresist processing, Semiconducting wafers, Coating, Thin film coatings, Control systems, Wafer testing, Photoresist materials, Lithography, Process control, Automatic tracking

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