High-NA EUV technology enables cost-effective patterning below the 5nm node. The integration is simpler but still requires multiple innovations. Thinner resists are needed for single-patterning enablement. The decrease in thickness poses a challenge for traditional metrology and inspection systems like OCD or CD-SEM, which lose sensitivity due to diminishing interaction volume. The reverse is true for Scanning Probe Microscopy, which excels in the low-height patterning regime. Here we discuss patterning metrology and introduce defect inspection / review applications for High-NA EUV patterning using a high-throughput SPM.
Improved resolution of the High-NA EUV technology comes with thinner photoresist and smaller aspect-ratio requirements. Trade-offs include more stringent process control needs for resist loss and line roughness. Traditional metrologies like OCD or CD-SEM lose sensitivity due to diminishing interaction volume. A metrology technique that thrives in this regime is Scanning Probe Microscopy: thinner resist allows for higher scanning speed, and smaller aspect ratio for higher measurement accuracy. Here we propose a High-Throughput SPM technique as key enabler for High-NA EUV process control. Detailed, high-density full wafer measurements of resist loss, CD and roughness are enabled by a high-throughput, 4-head SPM toolset, and compared for different resist thicknesses down to 10nm. Sampling schemes consistent with scanner throughput are considered.
The performance of image-based and diffraction-based overlay metrology depends on the quality of optical signal returning from the buried mark. A desirable class of hard mask materials are the metal-based hard masks. The challenge with metal-based hard masks is that they are typically opaque in the visible range. To enable overlay metrology, a costly process integration scheme replaces the opaque material over the overlay target, while another detects residual topography propagating through the film. Here we discuss the progress towards the fully automated Scanning Probe Metrology tool that combines surface and subsurface channel information in a single image to measure overlay through opaque films.
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