Dr. Patrik W. Hoffmann Profile

Dr. Patrik W. Hoffmann

at EMPA

SPIE Involvement:

Author

Publications (10)

Proceedings Article | 19 February 2018 Paper

Microfabrication of curved sidewall grooves using scanning nanosecond excimer laser ablation

Jing Gong, Georgios Violakis, Daniel Infante, Patrik Hoffmann, André Kostro, Andreas Schüler

Proceedings Volume 10520, 105200Z (2018) https://doi.org/10.1117/12.2286908

KEYWORDS: Laser ablation, Compound parabolic concentrators, Excimer lasers, Transmittance, Polymers, Glasses, Microscopes, Microfabrication, Computer simulations, Solar energy

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Proceedings Article | 3 May 2007 Paper

Focused electron beam induced deposition of DUV transparent SIO2

Alexandre Perentes, Patrik Hoffmann, Frans Munnik

Proceedings Volume 6533, 65331Q (2007) https://doi.org/10.1117/12.736918

KEYWORDS: Toxic industrial chemicals, Oxygen, Silicon, Oxides, Molecules, Silicon carbide, Hydrogen, Electron beams, Chemical elements, Silica

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Proceedings Article | 13 September 2005 Paper

Comparison of fabrication methods of sub-100nm nano-optical structures and devices

Patrik Hoffmann, Ivo Utke, Alexandre Perentes, Tristan Bret, Christian Santschi, Vasilis Apostolopoulos

Proceedings Volume 5925, 592506 (2005) https://doi.org/10.1117/12.617142

KEYWORDS: Etching, Electron beam lithography, Metals, Dielectrics, Gold, Photonic crystals, Gallium, Photomasks, Molecules, Electron beams

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SPIE Journal Paper | 1 June 2005

Laser coupling with a multimode water-jet waveguide

Philippe Couty, Frank Wagner, Patrik Hoffmann

OE, Vol. 44, Issue 06, 068001, (June 2005) https://doi.org/10.1117/12.10.1117/1.1928280

KEYWORDS: Waveguides, Laser ablation, Water, Modulation, Glasses, Laser processing, Laser applications, Optical engineering, Helium neon lasers, Laser cutting

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Proceedings Article | 14 November 2003 Paper

Laser-assisted microstructuring for Ti:sapphire channel-waveguide fabrication

A. Crunteanu, Markus Pollnau, G. Janchen, C. Hibert, Patrik Hoffmann, Rene-Paul Salathe, Robert Eason, David Shepherd

Proceedings Volume 5147, (2003) https://doi.org/10.1117/12.543706

KEYWORDS: Laser ablation, Sapphire, Reactive ion etching, Planar waveguides, Channel waveguides, Luminescence, Waveguides, Excimer lasers, Etching, Atomic force microscopy

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Proceedings Article | 11 June 2003 Paper

Limits of 3D nanostructures fabricated by focused electron beam (FEB) induced deposition

P. Hoffmann, I. Utke, F. Cicoira

Proceedings Volume 5023, (2003) https://doi.org/10.1117/12.510421

KEYWORDS: Electron beams, Molecules, Diffusion, Carbon, Scanning electron microscopy, Gold, Transmission electron microscopy, Nanostructures, Deposition processes, Adsorption

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Proceedings Article | 30 May 2003 Paper

A look into life sciences: more than a side step from industrial inspection?

Theo Lasser, Tiemo Anhut, Alexandre Serov, Kai Hassler, Ramachandra Rao, Marcel Leutenegger, Adrian von Muehlenen, Rodrigue Chatton, Patrik Hoffmann, Ivo Utke, Radivoje Popovic, Pierre-Andre Besse, Alexis Rochas, Michael Gosch, Rudolf Rigler, Robert Brunner

Proceedings Volume 5144, (2003) https://doi.org/10.1117/12.508363

KEYWORDS: Fluorescence correlation spectroscopy, Molecules, Luminescence, Molecular spectroscopy, Inspection, Fluorescence spectroscopy, Molecular energy transfer, Confocal microscopy, Life sciences, Diffusion

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Proceedings Article | 20 September 2001 Paper

OPART: an intelligent sensor dedicated to ground robotics

Andre Dalgalarrondo, Dominique Luzeaux, Patrik Hoffmann

Proceedings Volume 4364, (2001) https://doi.org/10.1117/12.439996

KEYWORDS: Image processing, Sensors, Video, Field programmable gate arrays, Charge-coupled devices, Robotics, Video processing, Intelligent sensors, Cameras, Target detection

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Proceedings Article | 6 November 2000 Paper

Electro-osmotic flow control in microchannels produced by scanning excimer laser ablation

Frank Wagner, Patrik Hoffmann

Proceedings Volume 4088, (2000) https://doi.org/10.1117/12.405726

KEYWORDS: Laser ablation, Positron emission tomography, Excimer lasers, Microfluidics, Polymers, Laser drilling, Silica, Surface properties, Prototyping, Lab on a chip

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Proceedings Article | 1 October 1990 Paper

Fast in situ processing for multichip high density interconnects

Patrik Hoffmann, M. Widmer, B. Lecohier, H. Solka, Hubert van den Bergh

Proceedings Volume 1352, (1990) https://doi.org/10.1117/12.23728

KEYWORDS: Copper, Molybdenum, Metals, Platinum, Solids, Gold, Chemical vapor deposition, Hydrogen, Laser processing, Electron beams

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Three different approaches to fast in situ processing of metal contacts are studied. The goal is to make high density interconnects with width, thickness and pitch respectively of the order of 10, 5 and 25 microns. The direct writing speed should be equal to or faster than 1 cm per second, while maintaining good electrical conductivity and surface adhesion of the metal stripes. The first approach is the classical laser chemical vapor deposition of copper from its bishexafluoroacetylacetonate (Cubishfa) precursor, which is pushed towards the practical limits of maximum writing speed. Seeding of the transparent glass-like substrates with layers of different metals and oxides which are extremely thin helps to increase the writing speed of this process significantly without substantially influencing the substrate's electrical properties. Writing speeds close to 1 cm l are attained. The second approach is to deposit metal from surface layers of metalorganic (MO) cluster compounds like Au55(P03)12Cl6 which have advantageous thermochemistry for the decomposition as well as a high metal content in the MO precursor. Such compounds can be decomposed with a laser to yield quite pure gold lines at speeds up to 10 cm s1. Such layers are also irradiated with ion and electron beams in an effort to try to make submicron metal contacts. The third approach consists of a fast in situ step in which the surface is locally prenucleated by decomposing an ultrathin MO layer with a photon or particle beam. In a second slow parallel processing step, a large number of prenucleated substrates are then "developed". The latter implies the selective metal deposition exclusively on top of the prenucleated stripes to create several micron thick metallic electrical contacts. We report on the selective metal deposition on ultrathin Pt prenucleation layers by electroless deposition from a copper sulfate bath, by decomposition from a copper formate solid surface layer, and by low pressure chemical vapor deposition from gaseous Cubishfa. Prenucleation was also tested with other metals.

Showing 5 of 10 publications

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