Today’s industrial fiber lasers mean hands-off, maintenance free operation for more than 15,000h beam-on time in 24/7 high speed, high precision marking. High conversion efficiency allows for strictly air-cooled, extremely compact and easy to integrate laser-marking systems. Latest marking software in conjunction with dual head systems for enlarged marking fields offers much higher productivity than conventional dual head YAG laser marking technology. Fast marking of metals and ceramics is now also possible with today’s power levels.
Conference Committee Involvement (4)
Laser-Based Micro-Packaging
29 January 2004 | San Jose, Ca, United States
Laser-Based Packaging in Microelectronics and Photonics II
30 January 2003 | San Jose, CA, United States
Advances in Fiber Lasers
27 January 2003 | San Jose, CA, United States
Laser-Based Packaging in Microelectronics and Photonics
24 January 2002 | San Jose, California, United States
Access to the requested content is limited to institutions that have purchased or subscribe to SPIE eBooks.
You are receiving this notice because your organization may not have SPIE eBooks access.*
*Shibboleth/Open Athens users─please
sign in
to access your institution's subscriptions.
To obtain this item, you may purchase the complete book in print or electronic format on
SPIE.org.
INSTITUTIONAL Select your institution to access the SPIE Digital Library.
PERSONAL Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.