A brand-new approach in developing VCSEL lense is presented in this paper. Using the laser process or yellow light
lithography process, we can merge semiconductor laser and diffraction optics elements (DOE) to become a single
semiconductor optoelectronic device. To match the surface topology of the DOE with the structure of semiconductor
laser, the DOE is carved on the SiO2 layer of the vertical-cavity surface-emitting laser (VCSEL). The chiseled
optoelectronic semiconductor element becomes as a DOE-VCSEL device, it has the DOE function to control the
emission distribution of the emitting laser.
A state-of-the-art strategy in developing novel technologies is offered in this paper. Using MEMS, resonant cavity LED
(RCLED) and DOE processes, one can manufacture an integrated optoelectronic semiconductor device. Using MEMS
process to implement the surface topology of the DOE on the diffraction layer of the resonant cavity LED, the chiseled
RCLED will become as a DOE-RCLED. The DOE-RCLED can be used to control the energy distribution of the emitted
light. In this paper, the scalar diffraction principle and Dammann grating are used to design a special LED of which the
emitted light can be focused on an optical fiber.
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