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Tobias Waber
at Hochschule für Angewandte Wissenschaften München
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Publications (1)
Proceedings Article | 17 May 2013 Paper
Flip-chip packaging of piezoresistive barometric pressure sensors
T. Waber, W. Pahl, M. Schmidt, G. Feiertag, S. Stufler, R. Dudek, A. Leidl
Proceedings Volume 8763, 87632D (2013) https://doi.org/10.1117/12.2016459
KEYWORDS: Sensors, Packaging, Copper, Adhesives, Microelectromechanical systems, Aluminum, Ceramics, Standards development, Temperature metrology, Sensor technology
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