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Dr. Thomas L. Haslett
Chief Technology Officer at Avo Photonics Inc
SPIE Involvement:
Conference Program Committee | Author
Publications (5)
Proceedings Article | 13 March 2024 Presentation
Automated die bonding of photonic chips
Tom Haslett, Stephen Peduto, Richard Lodge
Proceedings Volume PC12866, PC128660E (2024) https://doi.org/10.1117/12.3003281
KEYWORDS: Laser bonding, Semiconductor lasers, Reliability, Microelectromechanical systems
Proceedings Article | 12 July 2023 Open Access Paper
Micro-non-planar ring oscillator master oscillator for the NASA LISA laser transmitter
Anthony Yu, Kenji Numata, Scott Merritt, Bryan Nelsen, David Demmer, Jonathan Goettler, Tom Haslett, Thomas Kane
Proceedings Volume 12777, 1277747 (2023) https://doi.org/10.1117/12.2690676
KEYWORDS: Oscillators, Astronomical imaging, Nanoimprint lithography, Transmitters
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Proceedings Article | 5 March 2021 Presentation
Second-generation fluorescent nuclear track detector reader
Lukasz Maksymiuk, David Demmer, Ryan Ehid, Vasiliy Fomenko, Jonathan Harrison, Marc Million, Thomas Haslett, Mark Akselrod
Proceedings Volume 11693, 116930A (2021) https://doi.org/10.1117/12.2578784
KEYWORDS: Sensors, Image quality, Raster graphics, Radiation dosimetry, Photons, Particles, Packaging, Optical components, Optical alignment, Medical research
Proceedings Article | 14 March 2018 Presentation
Opto-electronic packaging of fiber-coupled systems (Conference Presentation)
Sven Mahnkopf, Tom Haslett, Apurva Jain
Proceedings Volume 10513, 105130A (2018) https://doi.org/10.1117/12.2287956
KEYWORDS: Packaging, Optoelectronic packaging, Optical design, Fiber couplers, Optical components, Laser packaging, Reliability, Semiconductor lasers
Proceedings Article | 27 February 2017 Presentation + Paper
Optoelectronic packaging of single photon avalanche diodes
S. Mahnkopf, A. Giudice, D. Demmer, T. Haslett, G. Simmerle
Proceedings Volume 10085, 100850C (2017) https://doi.org/10.1117/12.2255556
KEYWORDS: Single photon, Avalanche photodiodes, Packaging, Fiber couplers, Optoelectronic packaging, Photodetectors, Laser components, Optical design, Silicon, Multimode fibers, Tolerancing, Sensors
Conference Committee Involvement (2)
Components and Packaging for Laser Systems XI
27 January 2025 | San Francisco, California, United States
Components and Packaging for Laser Systems X
29 January 2024 | San Francisco, California, United States
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