CONFERENCE PROCEEDINGS
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YongHa Lee
at Park Systems Corp
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Author
Publications (4)
Proceedings Article | 18 April 2013 Paper
Introduction of next-generation 3D AFM for advanced process control
Proceedings Volume 8681, 868106 (2013) https://doi.org/10.1117/12.2011463
KEYWORDS: Atomic force microscopy, Process control, Metrology, Semiconductors, 3D metrology, Scatterometry, Lithography, Critical dimension metrology, Resolution enhancement technologies, Semiconducting wafers
Proceedings Article | 10 April 2013 Paper
3D AFM method for characterization of resist effect of aerial image contrast on side wall roughness
Proceedings Volume 8681, 86812Y (2013) https://doi.org/10.1117/12.2013657
KEYWORDS: Line edge roughness, Photoresist materials, Atomic force microscopy, Line width roughness, Scanning electron microscopy, 3D image processing, 3D scanning, Scanners, Laser scanners, Semiconductors
Proceedings Article | 5 April 2012 Paper
High-throughput and non-destructive sidewall roughness measurement using 3-dimensional atomic force microscopy
Yueming Hua, Cynthia Buenviaje-Coggins, Yong-ha Lee, Sang-il Park
Proceedings Volume 8324, 83240I (2012) https://doi.org/10.1117/12.918377
KEYWORDS: Atomic force microscopy, Photoresist materials, 3D image processing, 3D metrology, 3D scanning, Image resolution, Laser scanners, Metrology, Line edge roughness, Scanners
Proceedings Article | 20 April 2011 Paper
New three-dimensional AFM for CD measurement and sidewall characterization
Yueming Hua, Cynthia Buenviaje-Coggins, Yong-ha Lee, Jung-min Lee, Kyung-deuk Ryang, Sang-il Park
Proceedings Volume 7971, 797118 (2011) https://doi.org/10.1117/12.879545
KEYWORDS: Atomic force microscopy, Scanners, Photoresist materials, Critical dimension metrology, Line edge roughness, Line width roughness, Image resolution, Scanning electron microscopy, 3D metrology, Metrology
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