New opportunities enabled by heterogenous integration

Anna Tauke-Pedretti

doi:10.1117/12.3013819

8 June 2024 New opportunities enabled by heterogenous integration

Anna Tauke-Pedretti

Proceedings Volume PC13030, Image Sensing Technologies: Materials, Devices, Systems, and Applications XI; PC1303002 (2024) https://doi.org/10.1117/12.3013819
Event: SPIE Defense + Commercial Sensing, 2024, National Harbor, Maryland, United States

Abstract

Advancements in 3D heterogeneously integrated (3DHI) microsystems has the potential to radically change the compute and sensor system design. The dense and intimate integration of multiple chips can dramatically increase the interconnect bandwidth and increase the functionality of sensors and processor chips. The inclusion of integrated photonics in these architectures enables many of these benefits. This talk will share recent DARPA program investments in enabling these architectures. It will also discuss new challenges and opportunities these architectures present for heterogenous integration, photonic integrated circuit and microfabrication manufacturing technology.

Conference Presentation

Citation Download Citation

Anna Tauke-Pedretti "New opportunities enabled by heterogenous integration", Proc. SPIE PC13030, Image Sensing Technologies: Materials, Devices, Systems, and Applications XI, PC1303002 (8 June 2024); https://doi.org/10.1117/12.3013819

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