Fully Automated Alignment For Mos Device Processing On The Model 500 Full-Field Projection System

H, Sewell; F. Zernike

doi:10.1117/12.941892

29 June 1984 Fully Automated Alignment For Mos Device Processing On The Model 500 Full-Field Projection System

H, Sewell, F. Zernike

Proceedings Volume 0470, Optical Microlithography III: Technology for the Next Decade; (1984) https://doi.org/10.1117/12.941892
Event: 1984 Microlithography Conferences, 1984, Santa Clara, United States

Abstract

In recent years, much attention has been focused on the performance of automatic alignment systems used in the projection printing of semiconductor devices. This is as a result of the progressive tightening of overlay specifications for device processing in response to the ever present pressure to increase device packing density(1-4). This paper reports studies on the performance of the linear array camera automatic fine alignment system on the Model 500 1:1 projection system. The work was carried out on wafers fabricated using an NMOS process sequence, and took the form of an applications study directed at answering the question "What is the overlay performance of the Model 500 projection printer when used in a device production situation?"

Citation Download Citation

H, Sewell and F. Zernike "Fully Automated Alignment For Mos Device Processing On The Model 500 Full-Field Projection System", Proc. SPIE 0470, Optical Microlithography III: Technology for the Next Decade, (29 June 1984); https://doi.org/10.1117/12.941892

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