Fabrication Of 0.5 µm Poly-Si And Aluminum Interconnections By Means Of X-Ray Lithography And Plasma Etching

G Zwicker; L. Csepregi; H.-L. Huber; W Windbracke; A Heuberger

doi:10.1117/12.945632

14 June 1988 Fabrication Of 0.5 µm Poly-Si And Aluminum Interconnections By Means Of X-Ray Lithography And Plasma Etching

G Zwicker, L. Csepregi, H.-L. Huber, W Windbracke, A Heuberger

Author Affiliations +

Proceedings Volume 0923, Electron-Beam, X-Ray, and Ion Beam Technology: Submicrometer Lithographies VII; (1988) https://doi.org/10.1117/12.945632
Event: Medical Imaging II, 1988, Newport Beach, CA, United States

Abstract

This paper describes the replication and transfer of half-μm patterns into poly-Si and aluminum layers by means of x-ray lithography with synchrotron radiation and subsequent dry etching. The results show that plasma etching in a parallel plate reactor with powered upper electrode, working in the high pressure region is capable of anisotropic replication of half-μm features. Two novolak-based x-ray sensitive resists, Hunt HPR 204 and Hunt WX 242, were used as an etch mask. The processes employed were CC1⁴/He and C1₂/BC1J/CC14/N2 recipes for structuring poly-Si and aluminum respectively. The optimization of the Al etch recipe showed that the linewidth loss can be reduced below 0.05 pm by proper adjustment of the nitrogen flow.

Citation Download Citation

G Zwicker, L. Csepregi, H.-L. Huber, W Windbracke, and A Heuberger "Fabrication Of 0.5 µm Poly-Si And Aluminum Interconnections By Means Of X-Ray Lithography And Plasma Etching", Proc. SPIE 0923, Electron-Beam, X-Ray, and Ion Beam Technology: Submicrometer Lithographies VII, (14 June 1988); https://doi.org/10.1117/12.945632

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