Paper
2 May 2005 Prediction of the removal profile for tools having a finite contact patch; Technical Digest
Christophe Bouvier, Sheryl M. Gracewski, Edward Fess, Stephen J. Burns
Author Affiliations +
Abstract
A new generation of compliant tools and processes called UltraForm Finishing is under development at the Center for Optics Manufacturing (COM) and OptiPro Systems (Ontario, NY). The purpose is to achieve rapid, high quality finishing of hard materials. These compliant tools exhibit a large contact patch that can be up to 1 cm wide. A numerical model was developed to account for finite contact patch geometry on removal for a flat rotating axisymmetric workpiece. This model was used to determine the depth of removal as a function of radial position after the polishing tool has completely traversed the workpiece from its center to a given radial position. The depth of removal was investigated for circular and oval contact patches and a variety of removal functions. A constant removal depth is desired to minimize the induced figure error. Predicted results were compared to experimental measurements of induced figure error.
© (2005) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Christophe Bouvier, Sheryl M. Gracewski, Edward Fess, and Stephen J. Burns "Prediction of the removal profile for tools having a finite contact patch; Technical Digest", Proc. SPIE 10315, Optifab 2005: Technical Digest, 103150W (2 May 2005); https://doi.org/10.1117/12.606203
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KEYWORDS
Optics manufacturing

Polishing

Systems modeling

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