EUV reticle print verification with advanced broadband optical wafer inspection and e-Beam review systems

Ravikumar Sanapala; Andrew Cross; Moshe Preil; Jin Qian; Shishir Suman; Vidyasagar Anantha; Kaushik Sah; Scott Eitapence; Danilo De Simone; Dieter Van den Heuvel; Philippe Foubert

doi:10.1117/12.2281632

16 October 2017 EUV reticle print verification with advanced broadband optical wafer inspection and e-Beam review systems

Ravikumar Sanapala, Andrew Cross, Moshe Preil, Jin Qian, Shishir Suman, Vidyasagar Anantha, Kaushik Sah, Scott Eitapence, Danilo De Simone, Dieter Van den Heuvel, Philippe Foubert

Author Affiliations +

Proceedings Volume 10451, Photomask Technology 2017; 104510L (2017) https://doi.org/10.1117/12.2281632
Event: SPIE Photomask Technology and EUV Lithography, 2017, Monterey, California, United States

Abstract

As the Extreme Ultraviolet (EUV) lithography ecosystem is being actively mapped out to enable sub-7nm design rule devices, there is an immediate and imperative need to identify the EUV reticle (mask) inspection methodologies [1]. The introduction of additional particle sources due to the vacuum system and potential growth of haze defects or other film or particle depositions on the reticle, in combination with pellicle uncertainty pose unique inspection challenges when compared to 193i reticles. EUV reticles are typically inspected with optical reticle-inspection tools. However, if there is a pellicle on the EUV mask which is non-transmissive to the optical wavelengths used in the reticle inspection tools, then there is a need for alternative inspection methodologies based on inspection of printed wafers. In addition, due to the potential new defect mechanisms associated with the EUV reticles, fabs are looking for additional methods to re-qualify reticles in production using printed wafer inspections. The printed wafer inspection methodology is referred to as “Reticle Print Verification” or “Reticle Print Check.” This paper discusses these alternative inspection methodologies that are being developed in collaboration with imec using an advanced broadband plasma (BBP) patterned wafer optical inspection (KLA-Tencor 3905) and e-beam review systems (KLA-Tencor eDR7280).

Citation Download Citation

Ravikumar Sanapala, Andrew Cross, Moshe Preil, Jin Qian, Shishir Suman, Vidyasagar Anantha, Kaushik Sah, Scott Eitapence, Danilo De Simone, Dieter Van den Heuvel, and Philippe Foubert "EUV reticle print verification with advanced broadband optical wafer inspection and e-Beam review systems", Proc. SPIE 10451, Photomask Technology 2017, 104510L (16 October 2017); https://doi.org/10.1117/12.2281632

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available