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27 March 2018 Study of CFRP adhesive bonds influenced by manufacturing-related contaminations
Pawel H. Malinowski, Tomasz Wandowski, Wieslaw M. Ostachowicz, Angelos Christopoulos, Ilias Koulalis, Konstantinos Kitsianos, George Kanterakis, Romain Ecault, Rainer Stoessel, Damien Segur, Laurent Berthe, Maxime Sagnard, Fabienne Touchard, Michel Boustie, Welchy Leite Cavalcanti, Kai Brune
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Proceedings Volume 10598, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2018; 105980B (2018) https://doi.org/10.1117/12.2294511
Event: SPIE Smart Structures and Materials + Nondestructive Evaluation and Health Monitoring, 2018, Denver, Colorado, United States
Abstract
Composite materials are commonly used in many branches of industry. One of the effective methods to join CFRP parts is the adhesive bonding. There is a search of effective methods for quality assurance of bonded parts. There is a need for pre- and post-bond inspection to ensure proper bonding and verify its quality. Research reported here focuses on post-bond inspection of bonded CFRP parts. In this paper we report investigations of samples that were modified with contamination that can be encountered during the manufacturing process of the CFRP parts. The contaminations were introduced before adhesive bonding, and the effect of the contamination on the quality bond is studied. First of the investigated cases was release agent contamination prepared by dip-coating of clean CFRP plates. The release agent is used during the production of composite elements and can contaminate the surface to be bonded. The second case was the moisture contamination. It was obtained by conditioning of the samples in humid conditions. Moisture contamination can be gained from water-coupled ultrasonics or during transportation of unprotected parts. The third type of contamination had more local character. It simulated fingerprints. Artificial sweat was used. The fingerprint contamination can be caused by improper handling of the parts. Apart from single contamination, also mixed contamination cases were studied, as well as curved samples. The samples were studied in non-destructive approach. It was shown that for some of the cases the detection is possible.
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Pawel H. Malinowski, Tomasz Wandowski, Wieslaw M. Ostachowicz, Angelos Christopoulos, Ilias Koulalis, Konstantinos Kitsianos, George Kanterakis, Romain Ecault, Rainer Stoessel, Damien Segur, Laurent Berthe, Maxime Sagnard, Fabienne Touchard, Michel Boustie, Welchy Leite Cavalcanti, and Kai Brune "Study of CFRP adhesive bonds influenced by manufacturing-related contaminations", Proc. SPIE 10598, Sensors and Smart Structures Technologies for Civil, Mechanical, and Aerospace Systems 2018, 105980B (27 March 2018); https://doi.org/10.1117/12.2294511
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KEYWORDS
Contamination
Adhesives
Inspection
Sensors
Silicon
Magnetic sensors
Manufacturing
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