Development of scalable optical packaging for integrated photonics (Conference Presentation)

Peter O'Brien

doi:10.1117/12.2514698

4 March 2019 Development of scalable optical packaging for integrated photonics (Conference Presentation)

Peter O'Brien

Proceedings Volume 10924, Optical Interconnects XIX; 1092413 (2019) https://doi.org/10.1117/12.2514698
Event: SPIE OPTO, 2019, San Francisco, California, United States

Abstract

There is a growing demand for integrated photonic devices from a wide range of applications, including high-speed communications, medical devices and sensing. There has been significant research and development to address the demand for fiber-based optical interconnect for integrated photonic devices. However, applications such as medical diagnostics and remote sensing often require free-space coupling using micro optical components. As with fiber-based systems, packaging of micro optical components presents challenges in order to maximise coupling efficiencies and ensure packaging processes can be scaled to high-volume for cost-effective manufacturing. In this talk, I will present an overview of challenges in optical interconnect for integrated photonic devices, including Silicon, InP and SiN technologies. Factors including device layout, optical fiber and micro optical lens design will be reviewed. This includes the development of on-chip mode adaptors, improved device facet configurations for easier fiber packaging and specialty fibers which improve optical coupling efficiencies. The talk will also present information about the European Photonic Packaging Pilot Line, PIXAPP. The Pilot Line addresses the gap between early-stage prototypes and scaling to volume manufacturing. PIXAPP achieves this through the implementation of packaging design rules and working towards standard package designs. The talk will also present details of a novel optical test system which is being developed within the Pilot Line to ensure devices are characterised in advanced of packaging. PIXAPP is supporting a large number of companies develop their first photonics-based products and the talk will be of interest to those from a wide range of application areas.

Conference Presentation

Citation Download Citation

Peter O'Brien "Development of scalable optical packaging for integrated photonics (Conference Presentation)", Proc. SPIE 10924, Optical Interconnects XIX, 1092413 (4 March 2019); https://doi.org/10.1117/12.2514698

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available

Members: $17.00

Non-members: $21.00 ADD TO CART

PROCEEDINGS
PRESENTATION

WATCH
PRESENTATION SAVE TO MY LIBRARY

GET CITATION

KEYWORDS

Packaging

Integrated photonics

Integrated optics

Optics manufacturing

Optical components

Optical interconnects

Medical devices

Show All Keywords

Keywords/Phrases

Search In:

Publication Years