1Institute of Microelectronics (China) 2Univ. of Chinese Academy of Sciences (China) 3Mentor, a Siemens Business (United States) 4Mentor Graphics (Shanghai) Electronics Technology Co., Ltd. (China)
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Design technology co-optimization (DTCO) is one of the most critical considerations for yield breakthrough and product ramp-up during the life cycle of a new technology node. Traditional sign-off flow of physical verification cannot guarantee manufacturability totally. Comprehensive design for manufacturing (DFM) check should be involved in flow of product tape-out in order to recognize the patterning and other process challenges which would limit the wafer yield. The process related hotspots were pre-defined with the aid of process related simulation kits on cell, block as well as full chip levels. A systematic DTCO methodology including fabless process friendly flow with lithography friendly design (LFD), pattern match and chemical mechanical planarization (CMP) check, resolution enhancement technology (RET) synthesis, process window check for sensitive patterns as well as weak pattern library assisted circuit diagnosis was as an example of DTCO application at 14/12nm in this paper.
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Xiaojing Su, Yayi Wei, Rui Chen, Yajuan Su, Lisong Dong, Joe Kwan, Recoo Zhang, Chunshan Du, Qijian Wan, Xinyi Hu, "Systematic DTCO flow for yield improvement at 14/12nm technology node," Proc. SPIE 11328, Design-Process-Technology Co-optimization for Manufacturability XIV, 113280L (23 March 2020); https://doi.org/10.1117/12.2551861