Comparison of heat transfer coefficient according to the materials and structures

Kyeong-Ho Shin; Jihyun Kim; Dongsoo Jung; Joo-Hyung Kim

doi:10.1117/12.2563102

24 April 2020 Comparison of heat transfer coefficient according to the materials and structures

Kyeong-Ho Shin, Jihyun Kim, Dongsoo Jung, Joo-Hyung Kim

Proceedings Volume 11378, Nano-, Bio-, Info-Tech Sensors, and 3D Systems IV; 1137810 (2020) https://doi.org/10.1117/12.2563102
Event: SPIE Smart Structures + Nondestructive Evaluation, 2020, Online Only

Abstract

The modeling in this study was conducted to maximize the high performance of adhesive materials. Aluminum nitride (AlN) and epoxy resin were used to model AlN in the form of a sphere and resin in a liquid state. The results are expected to be dependent on the location of the sphere in the resin. First of all, spherical AlN is regularly stacked in the basic form of 3x3. Secondly, the volume ratio of AlN was maximized at a unit volume considered of the packing factor of AlN. Air pockets with the same diameter of AIN can be substantially added inside the resin. Then, the heat transfer coefficient of the air was very low, so it was considered as a factor that could sufficiently affect the heat transfer coefficient of the adhesive material. The modeling was compared the cases with and without the air pockets. Thirdly, the modeling of the same structures showed the larger heat transfer rate when the material was changed to zinc oxide (ZnO), which has the larger heat transfer coefficient than AlN. Finally, the molecular crystal of ZnO can be implemented as a tetrapod type. The ZnO of tetrapod type had the good heat transfer rate because of the greater proportion per unit volume than the sphere.

Conference Presentation

Citation Download Citation

Kyeong-Ho Shin, Jihyun Kim, Dongsoo Jung, and Joo-Hyung Kim "Comparison of heat transfer coefficient according to the materials and structures", Proc. SPIE 11378, Nano-, Bio-, Info-Tech Sensors, and 3D Systems IV, 1137810 (24 April 2020); https://doi.org/10.1117/12.2563102

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