Investigation of a photonic displacement sensor

Keegan Jauch; Nikhil Agarwal; Edoardo Rubino

doi:10.1117/12.2567910

20 August 2020 Investigation of a photonic displacement sensor

Keegan Jauch, Nikhil Agarwal, Edoardo Rubino

Proceedings Volume 11498, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications XIV; 114980H (2020) https://doi.org/10.1117/12.2567910
Event: SPIE Optical Engineering + Applications, 2020, Online Only

Abstract

The objective of this research is to determine the feasibility of a displacement sensor that can find applications in the fields of material characterization and structural health monitoring that is based on the Whispering Gallery Modes (WGMs) phenomenon. The proposed sensor configuration consists of a circular optical resonator embedded in a polymeric beam fixed at both ends. When the sensor is embedded within a beam, a deformation of the beam will result in a change of the morphology (deformation) of the resonator and consequently a shift in the wavelength of the optical modes. The optical modes produced in these types of resonators are extremely narrow showing a high optical quality factor and consequently leading to high-resolution sensors. An analysis based on the finite element method was performed to determine the behavior of this configuration. The purpose of this analysis is to determine the mechanical strain occurring along the circular resonator perimeter due to the application of the external linear displacement. Several parameters were investigated with regards to sensor sensitivity, including the resonator location within the beam and its diameter. Results show that with a resonator diameter of 3 mm located at the center in the horizontal direction and close to the top of the beam, a sensitivity of 0.05mm-1 can be obtained.

Conference Presentation

Citation Download Citation

Keegan Jauch, Nikhil Agarwal, and Edoardo Rubino "Investigation of a photonic displacement sensor", Proc. SPIE 11498, Photonic Fiber and Crystal Devices: Advances in Materials and Innovations in Device Applications XIV, 114980H (20 August 2020); https://doi.org/10.1117/12.2567910

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