Effect of resist film thickness on line-and-space resist patterns on chromium nitride in electron beam lithography

Akihiro Konda; Kazumasa Okamoto; Takahiro Kozawa; Takao Tamura

doi:10.1117/12.2584016

22 February 2021 Effect of resist film thickness on line-and-space resist patterns on chromium nitride in electron beam lithography

Akihiro Konda, Kazumasa Okamoto, Takahiro Kozawa, Takao Tamura

Author Affiliations +

Proceedings Volume 11612, Advances in Patterning Materials and Processes XXXVIII; 116120Y (2021) https://doi.org/10.1117/12.2584016
Event: SPIE Advanced Lithography, 2021, Online Only

Conference Poster

Abstract

Electron beam (EB) lithography is indispensable for the fabrication of photomasks including extreme ultraviolet masks. With the miniaturization of electronic devices, the requirement for photomasks becomes severe. When the feature size was decreased, the resist patterns collapse due to the surface tension of liquid. The decrease of resist film thickness is required for the high-resolution patterning in order to avoid pattern collapse. However, the quality of resist patterns is known to be degraded. In this study, the resist film thickness dependence of the pattern formation of a chemically amplified electron beam resist on chromium nitride substrate was investigated.

Conference Presentation

Citation Download Citation

Akihiro Konda, Kazumasa Okamoto, Takahiro Kozawa, and Takao Tamura "Effect of resist film thickness on line-and-space resist patterns on chromium nitride in electron beam lithography", Proc. SPIE 11612, Advances in Patterning Materials and Processes XXXVIII, 116120Y (22 February 2021); https://doi.org/10.1117/12.2584016

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