Development of an on-the-fly percussion drilling process based on pulse bursts

Dennis Haasler; Christian Beckers

doi:10.1117/12.2576896

10 March 2021 Development of an on-the-fly percussion drilling process based on pulse bursts

Dennis Haasler, Christian Beckers

Proceedings Volume 11679, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems X; 116790E (2021) https://doi.org/10.1117/12.2576896
Event: SPIE LASE, 2021, Online Only

Abstract

High productive laser drilling processes usually employ an on-the-fly single-pulse drilling process. This process achieves a productivity of up to several hundred holes per second but is usually limited to hole diameters in the order of magnitude of ~100 μm and hole depths below 1 mm. Moreover, the geometrical and metallographic hole quality is limited. Larger or deeper holes can be drilled by means of percussion drilling processes which also results in an increased hole quality. However, the productivity for percussion drilling is only in the range of a few holes per second at best due to the positioning time of the optic for each hole. In this paper we present the development of a new drilling process which combines the advantages of an on-the-fly process with the achievable size and quality of a percussion drilling process. Instead of a single pulse, an elaborately designed short pulse burst is emitted to drill the hole during the relative movement between the drilling optic and workpiece. The impact of each pulse of the pulse burst on the final shape of the hole is evaluated by a systematic variation of the process parameters. A drilling process to achieve a hole diameter of Ø500 μm in 2 mm thick aluminum was designed and a drilling speed of 15 holes per second has been demonstrated with a relative standard deviation of less than 5% for the entry and exit diameter.

Conference Presentation

Citation Download Citation

Dennis Haasler and Christian Beckers "Development of an on-the-fly percussion drilling process based on pulse bursts", Proc. SPIE 11679, High-Power Laser Materials Processing: Applications, Diagnostics, and Systems X, 116790E (10 March 2021); https://doi.org/10.1117/12.2576896

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