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Emerging 3D sensing devices using structured light illumination (SLI) technology must provide high accuracy over a wide operating temperature range and variety of lighting conditions. That's because phone-makers want the 3D sensing component to function consistently across temperature extremes and from daylight to darkness. Corning® HPFS® Fused Silica (High Purity Fused Silica) has refractive index uniformity that's up to 2.5x better than other fused silicas and has low birefringence properties. This enables optimal performance in emerging, high-resolution, SLI-based 3D sensing devices. Corning has already demonstrated significant capacity for producing high volumes of HPFS for precise, 3D sensing applications such as facial recognition. Wafer-Level Optic Solutions is one of several product lines in Corning's newly formed Advanced Optics business unit, Precision Glass Solutions. This product line includes multiple glass compositions besides HPFS® enabling emerging micro-optic applications including 3D sensors, filters, spacers, and wafer-level caps. In this 3D sensing demonstration, we are showing typical optical components in a structured light-based 3D sensing module. This demo shows how light passes through a DOE (diffractive optical element) to create a unique pattern necessary for highly accurate 3D sensing applications. The demo features the DOE, lens substrates, and a spacer. For more information, please visit www.corning.com/advanced-optics or contact Sid Mahajan, product line manager, Corning Advanced Optics: MahajanS@corning.com 1-607-974-6510
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