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The two unique features of the plasmonic isolator and the plasmonic modulator are their small size of about 10-100 μm and their technological compatibility with the Photonic Integrated Circuits (PIC). These features make them attractive as components for a denser and smaller PIC. An additional advantage of the plasmonic modulator is its ultra-fast operational speed, which exceeds 200 GHz. We have developed and experimentally demonstrated two fabrication technologies, which allow a substantial decrease of both the plasmonic propagation loss and the coupling loss. The developed technologies are based on the optimization of the out-of-plane confinement and the in-plane confinement for a surface plasmon. A low propagation loss of 0.7 dB/μm for a surface plasmon in a Co/TiO2/SiO2 plasmonic structure on a Si substrate and a moderate coupling efficiency of 4 dB per facet between a Co/TiO2/SiO2 and a Si nanowire waveguide were achieved.
Vadym Zayets,Iryna Serdeha, andValerii Grygoruk
"Challenges of design and fabrication technology of plasmonic components for Photonic Integrated Circuits", Proc. SPIE 12004, Integrated Optics: Devices, Materials, and Technologies XXVI, 120040O (5 March 2022); https://doi.org/10.1117/12.2612797
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Vadym Zayets, Iryna Serdeha, Valerii Grygoruk, "Challenges of design and fabrication technology of plasmonic components for Photonic Integrated Circuits," Proc. SPIE 12004, Integrated Optics: Devices, Materials, and Technologies XXVI, 120040O (5 March 2022); https://doi.org/10.1117/12.2612797