Presentation + Paper
27 May 2022 Fiber-optic sensor packaging assessment and benchmarking for embedded sensing applications
Author Affiliations +
Abstract
Fiber optic-based sensing for non-destructive evaluation (NDE) and structural health monitoring of various infrastructure and energy assets is an increasingly important sensing scheme. Because of their immunity to electromagnetic interferences, versatility in sensing mechanisms and designs as well as capability for distributed sensing, the fiber optic sensing is of great interest for embedding within infrastructures using advanced manufacturing methods. However, the protection of fiber optic sensors during advanced manufacturing-based embedding is an important aspect for infrastructure monitoring in practice. While successful installation of fiber optic sensors has been accomplished through application of epoxy or adhesives on infrastructure surfaces, there has been only limited investigation of fiber protection packaging schemes which are compatible with in-situ repair techniques such as the metallic cold-spray. With increasing interest and importance of cold spray-based repair processes, the integration of fiber optic sensors simultaneously during the repair is equally important. In this work, we focus our efforts on investigating various types of packaging schemes for their compatibility and integrability on the surfaces of metallic structures such as oil and gas pipelines during an insitu repair coating. First, we consider sandblasting using silica sand particles of various size for optical fibers on the surface of a metallic coupon as a useful proxy test of sensor packaging stability. Structural damage of packaging is characterized by means of optical microscopy and the optical integrity of embedded fiber optic cables is examined using optical backscatter reflectometry (OBR). In addition, initial investigation of metallic cold-spray embedded fiber optic cables under various packaging on metallic substrates is also considered with early conclusions and future directions.
Conference Presentation
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Dolendra Karki, Christopher Smith, Joseph Damian, Kayte M Denslow, Glenn Grant, Jung-Kun Lee, and Paul R. Ohodnicki "Fiber-optic sensor packaging assessment and benchmarking for embedded sensing applications", Proc. SPIE 12105, Fiber Optic Sensors and Applications XVIII, 1210505 (27 May 2022); https://doi.org/10.1117/12.2618492
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KEYWORDS
Fiber optics sensors

Optical fibers

Fiber optics

Nondestructive evaluation

Structural health monitoring

Fiber coatings

Optical fiber cables

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