Paper
27 March 2022 Experimental investigation on laser in-situ assisted ultra-precision cutting of fused silica
Chuangting Lin, Changlin Liu, Xiao Chen, Xin Su, Fuyao Lai, Jianguo Zhang, Junfeng Xiao, Jianfeng Xu
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Proceedings Volume 12169, Eighth Symposium on Novel Photoelectronic Detection Technology and Applications; 121691K (2022) https://doi.org/10.1117/12.2622278
Event: Eighth Symposium on Novel Photoelectronic Detection Technology and Applications, 2021, Kunming, China
Abstract
Fused silica has been widely used in precision instruments in extreme environment for its excellent properties such as high temperature resistance and thermal shock resistance. However, the brittleness and hardness nature of fused silica makes it difficult to achieve high quality surface through conventional technology. In recent years, the laser in-situ assisted machining has been proposed as a promising technique for ultra-precision machining of many brittle and hard materials. In this study, numerical simulations and cutting experiments were conducted to study the temperature field and cutting mechanism in laser in-situ assisted machining of fused silica. The cutting temperature and machined surface quality under different machine parameters were characterized. The results indicate that the assistance of laser improves the material’s ductile machinability significantly, which contributes to a higher surface quality compared to conventional machining. The depth of cut (DOC), laser power and rotation speed have a great impact on the surface quality, and surface roughness values in the order of 20 nm can be achieved under appropriate machine parameters.
© (2022) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Chuangting Lin, Changlin Liu, Xiao Chen, Xin Su, Fuyao Lai, Jianguo Zhang, Junfeng Xiao, and Jianfeng Xu "Experimental investigation on laser in-situ assisted ultra-precision cutting of fused silica", Proc. SPIE 12169, Eighth Symposium on Novel Photoelectronic Detection Technology and Applications, 121691K (27 March 2022); https://doi.org/10.1117/12.2622278
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KEYWORDS
Temperature metrology

Silicon

Crystals

Surface roughness

Diamond

Diamond machining

Optical simulations

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