Paper
17 May 2022 CFD simulation of heat pipe for embedded envelope based on ANSYS
Liang Qiu, Tianqi Wu, Chuanjin Zhao, Shichen Yang
Author Affiliations +
Proceedings Volume 12259, 2nd International Conference on Applied Mathematics, Modelling, and Intelligent Computing (CAMMIC 2022); 1225931 (2022) https://doi.org/10.1117/12.2638939
Event: 2nd International Conference on Applied Mathematics, Modelling, and Intelligent Computing, 2022, Kunming, China
Abstract
Based on the finite element analysis software, numerical simulations are carried out for the heat pipe embedded in the enclosure. Firstly, a CFD model is developed for a two-phase heat siphon heat pipe with unidirectional heat transfer function, and the experimental condition of liquid filling rate of 0.6 is used to obtain the internal phase distribution clouds of the heat pipe under four different heat flow density conditions The simulation of the evaporative section is consistent with the visualization experiment, and the VOF model is able to describe the gas-liquid separation and bubble aggregation phenomena realistically and accurately. Finally, the practical application prospects of the enclosure structure and the shortcomings of the research are pointed out.
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Liang Qiu, Tianqi Wu, Chuanjin Zhao, and Shichen Yang "CFD simulation of heat pipe for embedded envelope based on ANSYS", Proc. SPIE 12259, 2nd International Conference on Applied Mathematics, Modelling, and Intelligent Computing (CAMMIC 2022), 1225931 (17 May 2022); https://doi.org/10.1117/12.2638939
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KEYWORDS
Liquids

3D modeling

Resistance

Numerical simulations

Thermal modeling

Computer simulations

Heat flux

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