Paper
1 June 1990 Chemical amplification negative resist systems composed of novolac, silanols, and acid generators
Takumi Ueno, Hiroshi Shiraishi, Nobuaki Hayashi, Keiko Tadano, Emiko Fukuma, Takao Iwayanagi
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Abstract
Negative chemical amplification resist systems composed of Novolak resin, a silanol compound, and an acid generator are investigated as deep UV resists. The acid produced in the exposed area induces the condensation reaction of silanol compounds during post-exposure baking. The condensation reaction products, siloxanes, act as an aqueous-base dissolution inhibitor, while silanol compounds in unexposed area work as aqueous base dissolution promoters. The resist composed of Novolak resin, diphenylsilanediol, and triphenylsulfonium triflate shows quite high sensitivity (-.-lmJ/cm2). Using this resist, O.3pm line-and-space patterns were obtained by KrF excimer laser stepper with 3mJ/cm2 dose.
© (1990) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Takumi Ueno, Hiroshi Shiraishi, Nobuaki Hayashi, Keiko Tadano, Emiko Fukuma, and Takao Iwayanagi "Chemical amplification negative resist systems composed of novolac, silanols, and acid generators", Proc. SPIE 1262, Advances in Resist Technology and Processing VII, (1 June 1990); https://doi.org/10.1117/12.20085
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Cited by 4 scholarly publications and 1 patent.
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KEYWORDS
Deep ultraviolet

Lithography

Absorbance

Excimer lasers

Chlorine

Infrared spectroscopy

Lutetium

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