Small angle x-ray scattering overlay metrology for advanced nodes

Timothée Choisnet; Guillaume Freychet; Yoann Blancquaert; Patrice Gergaud

doi:10.1117/12.3010744

9 April 2024 Small angle x-ray scattering overlay metrology for advanced nodes

Timothée Choisnet, Guillaume Freychet, Yoann Blancquaert, Patrice Gergaud

Proceedings Volume 12955, Metrology, Inspection, and Process Control XXXVIII; 1295535 (2024) https://doi.org/10.1117/12.3010744
Event: SPIE Advanced Lithography + Patterning, 2024, San Jose, California, United States

Conference Poster

Abstract

With a sub-nanometric resolution required for nodes below 14 nm, according to the International Roadmap for Devices and Systems (IRDS), exploring new overlay characterization methods is key to drive further component size reduction and develop better-performing technologies. In this work, we present our first Small-Angle x-ray Scattering (SAXS) results of overlay measurements on stacks of silicon line gratings. Our method, novel for SAXS overlay measurements, is based on inverse problem resolution and reconstructs the in-depth profile (approximated as a stack of trapezoids) of the structure. We are thus able to extract overlay with SAXS with a very fine sensitivity, high precision and sub-nanometric resolution that suit the requirements for advanced technological nodes. We compared these results with those of Scanning Electron Microscopy (SEM) contour-based on product overlay. The reconstructed structures are compared to profiles obtained with Scanning Transmission Electron Microscopy (STEM). From the differences between these multi-scale techniques we can conclude on the high potential of SAXS to become a complementary to those existing, and assess its potential for advanced technology nodes.

(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.

Citation Download Citation

Timothée Choisnet, Guillaume Freychet, Yoann Blancquaert, and Patrice Gergaud "Small angle x-ray scattering overlay metrology for advanced nodes", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 1295535 (9 April 2024); https://doi.org/10.1117/12.3010744

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available