Poster + Paper
9 April 2024 AI-powered deconvolution-based super-resolution imaging for semiconductor OCD metrology and precise stage positioning
Author Affiliations +
Conference Poster
Abstract
This study develops a parametric system transfer function (STF) model using scalar diffraction theory and Fourier optics to address the loss of precision in image-based positioning caused by the diffraction limit on marker scale. By fitting the model to observed STFs and employing deconvolution and a deep convolutional neural network, the method enhances image quality, overcoming traditional deconvolution limitations. Applied to critical dimension measurements, it improved radius accuracy for vias and pillars by 54.8% and reduced displacement measurement bias by 36.4%. The development particularly benefits automatic optical inspection (AOI) for quality control in semiconductor manufacturing.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Yu-Ting Cheng, Wei-Yun Lee, Ming-Jie Liu, Wei-Hsin Chein, and Liang-Chia Chen "AI-powered deconvolution-based super-resolution imaging for semiconductor OCD metrology and precise stage positioning", Proc. SPIE 12955, Metrology, Inspection, and Process Control XXXVIII, 129553D (9 April 2024); https://doi.org/10.1117/12.3010986
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KEYWORDS
Image processing

Point spread functions

Image deconvolution

Deconvolution

Resolution enhancement technologies

Systems modeling

Image enhancement

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