In the face of the escalating challenges posed by Moore's Law, semiconductor manufacturers find themselves compelled to explore innovative techniques aimed at enhancing the density of chip components. The reduction in pitches to sizes below 32nm and the adoption of advanced semiconductor packaging technologies have become common strategies. However, this evolution in chip architecture has led to an increase in nano-scale defects, necessitating the development of an ADCD framework. Yet, the scarcity of comprehensive data for training inspection models impedes progress. SEM imaging and manual defect labelling are resource-intensive, and the sensitivity of wafer images precludes data sharing among different foundries/users/manufacturers. Moreover, the variability in defect classes and occurrences across different clients further complicates the development of a universally applicable model. To address these challenges, we propose a decentralized Federated Learning framework utilizing the YOLOv8 object detection model. By securely leveraging the diverse datasets among participants without exchanging sensitive information, our approach aims to create a more generalizable model.
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