This article analyzes the phenomenon of LED junction temperature changing with the circuit and environment, and proposes an improved measurement of LED junction temperature based on infrared thermal imaging method. By fitting the curve between heat transfer parameters and LED chip and packaging parameters, an LED experimental model is constructed, and junction temperature detection experiments and theoretical simulations are carried out. The results indicate that compared to traditional infrared thermal imaging methods, this method is more convenient and intuitive, and can quickly measure LED junction temperature. Finally, this article compares the LED junction temperature detection results under different experimental conditions to verify the universality of this method.
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