CONFERENCE PROCEEDINGS
Advanced Search
Home > Proceedings > Volume 12981 > Article
Paper
4 March 2024 Icepak-based heat sink optimization design for automotive domain controllers
Tiecheng Wang, Lei Han, Jimin Ni, Shi Zheng
Author Affiliations +
Proceedings Volume 12981, Ninth International Symposium on Sensors, Mechatronics, and Automation System (ISSMAS 2023); 129814E (2024) https://doi.org/10.1117/12.3015345
Event: 9th International Symposium on Sensors, Mechatronics, and Automation (ISSMAS 2023), 2023, Nanjing, China
Abstract
With the development of automotive electronic and electrical architectures, domain controllers are also developing towards miniaturization and high integration, with the consequent increase in power density and intensification of heat dissipation problems. In this paper, a domain controller installed in the front compartment of a car is used to analyze the total heat production. The effect of different heat sink thickness and fin parameters on the heat dissipation of the heat sink was studied based on Icepak using a multi-parameter optimization method and the optimal combination of parameters was used for heat sink optimization. Thermal test results show that the maximum temperature of MOSFETs (Metal-Oxide-Semiconductor Field-Effect Transistor) is reduced by 9.6% and the average temperature is reduced by 8.5% after multi-parameter optimization. The heat sink mass is reduced by 7.6%. The heat sink can better meet the heat dissipation requirements. It proves the reliability of the optimized design method.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Citation Download Citation
Tiecheng Wang, Lei Han, Jimin Ni, and Shi Zheng "Icepak-based heat sink optimization design for automotive domain controllers", Proc. SPIE 12981, Ninth International Symposium on Sensors, Mechatronics, and Automation System (ISSMAS 2023), 129814E (4 March 2024); https://doi.org/10.1117/12.3015345
ACCESS THE FULL ARTICLE
ORGANIZATIONAL
Sign in with credentials provided by your organization.
INSTITUTIONAL
Select your institution to access the SPIE Digital Library.
SELECT YOUR INSTITUTION
PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.
PERSONAL SIGN IN
No SPIE Account? Create one
PURCHASE THIS CONTENT
SUBSCRIBE TO DIGITAL LIBRARY
50 downloads per 1-year subscription
Members: $195
Non-members: $335 ADD TO CART
25 downloads per 1 - year subscription
Members: $145
Non-members: $250 ADD TO CART
PURCHASE SINGLE ARTICLE
Includes PDF, HTML & Video, when available
Members: $17.00
Non-members: $21.00 ADD TO CART
PROCEEDINGS
 7 PAGES
DOWNLOAD PAPER SAVE TO MY LIBRARY
GET CITATION
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Heatsinks
Design
Device simulation
Field effect transistors
Mathematical optimization
Electronic components
Modeling
RELATED CONTENT
Subscribe to Digital Library
Receive Erratum Email Alert
Back to Top