Paper
8 February 2024 System for detecting adhesive overflow in sensor chips based on improved Unet
Lei Chen, Zourong Long, Bin Tang, Mingfu Zhao, Yue Leisi, Yulong He, Fuping Wei
Author Affiliations +
Proceedings Volume 13066, International Conference on Optoelectronic Materials and Devices (ICOMD 2023); 1306615 (2024) https://doi.org/10.1117/12.3025172
Event: 2023 International Conference on Optoelectronic Materials and Devices (COMD 2023), 2023, Chongqing, China
Abstract
With the rapid development of information technology, traditional neural networks used as feature extraction networks can improve the network’s fitting ability but may lose information for small object detection, resulting in low accuracy. In this paper, the image acquisition device and Unet detection model were built independently. The algorithm accurately detects the sensor chip overflow using image processing techniques with OpenCV. Finally, the detected images are presented using PyQt.Experimental results show that the improved Unet-glue algorithm achieves better segmentation accuracy for chip overflow. It also demonstrates strong robustness and practicality in the field of small object defect detection.
(2024) Published by SPIE. Downloading of the abstract is permitted for personal use only.
Lei Chen, Zourong Long, Bin Tang, Mingfu Zhao, Yue Leisi, Yulong He, and Fuping Wei "System for detecting adhesive overflow in sensor chips based on improved Unet", Proc. SPIE 13066, International Conference on Optoelectronic Materials and Devices (ICOMD 2023), 1306615 (8 February 2024); https://doi.org/10.1117/12.3025172
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KEYWORDS
Image processing

Object detection

Sensors

Glues

Image segmentation

Detection and tracking algorithms

Education and training

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