Mechanical properties of thin films on substrates

Shefford P. Baker; William D. Nix

doi:10.1117/12.22398

1 December 1990 Mechanical properties of thin films on substrates

Shefford P. Baker, William D. Nix

Proceedings Volume 1323, Optical Thin Films III: New Developments; (1990) https://doi.org/10.1117/12.22398
Event: 34th Annual International Technical Symposium on Optical and Optoelectronic Applied Science and Engineering, 1990, San Diego, CA, United States

Abstract

Thin films that are used primarily for their optical, electronic, magnetic and chemical properties are not generally considered to be structural elements. Nonetheless, when thin films are auached to substrates, they are often found to support very high stresses which can cause both deformation and fracture to occur. Thus, the mechanical properties of thin films on substrates are of technological importance. In particular, the mechanical properties of optical thin films must be sufficient to insure their mechanical integrity and dimensional stability over the lifetime of the device in which they are used. The origins and consequences of internal stresses in thin films and variations in strength and stiffness from those expected of bulk materials are discussed. Two measurement techniques are presented. In the first, curvatures induced in a substrate by stresses in an attached thin film are measured to determine those stresses. The second technique involves determining the hardness and elastic modulus of a thin film while it is attached to a substrate using a depth-sensing indentation device.

Citation Download Citation

Shefford P. Baker and William D. Nix "Mechanical properties of thin films on substrates", Proc. SPIE 1323, Optical Thin Films III: New Developments, (1 December 1990); https://doi.org/10.1117/12.22398

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