Paper
1 February 1992 Positron lifetime studies of Al-Si Ohmic contact formed by rapid thermal processing
Revati N. Kulkarni, N. M. Kulkarni, Arvind D. Shaligram
Author Affiliations +
Proceedings Volume 1523, Conference on Physics and Technology of Semiconductor Devices and Integrated Circuits; (1992) https://doi.org/10.1117/12.57032
Event: Conference on Physics and Technology of Semiconductor Devices and Integrated Circuits, 1992, Madras, India
Abstract
Due to the involvement of shorter time and energy consumption, rapid thermal processing (RTP) technique finds its success in Semiconductor processing. The Al-Si ohmic contact has been formed and the effect of alloying temperatures between 450 degree(s)C and 550 degree(s)C on this contact has been studied. The nature of the contact is probed well by positron lifetime spectroscopy (PLTS). The measurements are supported by I - V characterization and SEM.
© (1992) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Revati N. Kulkarni, N. M. Kulkarni, and Arvind D. Shaligram "Positron lifetime studies of Al-Si Ohmic contact formed by rapid thermal processing", Proc. SPIE 1523, Conference on Physics and Technology of Semiconductor Devices and Integrated Circuits, (1 February 1992); https://doi.org/10.1117/12.57032
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Resistance

Aluminum

Spectroscopy

Silicon

Lamps

Scanning electron microscopy

Semiconductor manufacturing

RELATED CONTENT

Metrology of fused silica
Proceedings of SPIE (December 06 2016)
Low-frequency noise in porous Si LED
Proceedings of SPIE (May 12 2003)
Lactones in 193 nm resists: What do they do?
Proceedings of SPIE (April 15 2008)

Back to Top