Achieving mass fabrication of microoptical systems by combining deep-x-ray lithography, electroforming, micromolding, and embossing

Michael Abraham; Hans-Dieter Bauer; Wolfgang Ehrfeld; Mathias M. Gerner; Manfred Lacher; Heinz Lehr; Holger Loewe; Andreas Michel; Andreas Ruf; Helmut Schift; Andreas Schmidt; Lutz Weber

doi:10.1117/12.180982

28 July 1994 Achieving mass fabrication of microoptical systems by combining deep-x-ray lithography, electroforming, micromolding, and embossing

Michael Abraham, Hans-Dieter Bauer, Wolfgang Ehrfeld, Mathias M. Gerner, Manfred Lacher, Heinz Lehr, Holger Loewe, Andreas Michel, Andreas Ruf, Helmut Schift, Andreas Schmidt, Lutz Weber

Author Affiliations +

Proceedings Volume 2213, Nanofabrication Technologies and Device Integration; (1994) https://doi.org/10.1117/12.180982
Event: Integrated Optoelectronics '94, 1994, Lindau, Germany

Abstract

The paper reviews the application of deep X-ray lithography in conjunction with electroforming, plastic molding, and stamping (LIGA) for a mass production of micro- and submicron-structured photonic devices. LIGA technology offers almost total design freedom in lateral structuring and a high aspect ratio of 100. Vertical walls with heights up to 1 mm and optical grade surfaces enable their use as functional optical surfaces. It is possible to process a variety of materials such as metals and different polymers, including those with nonlinear optical properties. Therefore, Y-branches, couplers, and structures for the positioning and fixing of fibers, detectors, and light emitters can be integrated on one chip to build up hybrid optoelectronic devices.

Citation Download Citation

Michael Abraham, Hans-Dieter Bauer, Wolfgang Ehrfeld, Mathias M. Gerner, Manfred Lacher, Heinz Lehr, Holger Loewe, Andreas Michel, Andreas Ruf, Helmut Schift, Andreas Schmidt, and Lutz Weber "Achieving mass fabrication of microoptical systems by combining deep-x-ray lithography, electroforming, micromolding, and embossing", Proc. SPIE 2213, Nanofabrication Technologies and Device Integration, (28 July 1994); https://doi.org/10.1117/12.180982

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available