Resist Materials For High Resolution Photolithography

W. F. Cordes, III; R. F. Leonard

doi:10.1117/12.931888

28 July 1981 Resist Materials For High Resolution Photolithography

W. F. Cordes, III, R. F. Leonard

Proceedings Volume 0275, Semiconductor Microlithography VI; (1981) https://doi.org/10.1117/12.931888
Event: 1981 Microlithography Conferences, 1981, San Jose, United States

Abstract

Waycoat WX-118 is a new positive photoresist characterized by high photospeed and good resolution. WX-118 is highly responsive to Deep UV radiation (270-320 nm) as well as Conventional UV (>320 nm). Details are presented on this resist in regard to: 1) absorption spectra, 2) film thickness vs. spin speed, and 3) optimum softbake and hardbake conditions. WX-118 and Hunt's HPR-204 positive resists are compared in conventional UV exposure, both in contact and 1:1 projection. SEMs are presented to illustrate the superior resolution capabilities of WX-118 in a 1:1 projection system. The Deep UV data was obtained on a UV-3 Micralign 1:1 projection system where AZ-2400 was used as a comparison. SEMs are used to present information on the unique resist sidewalls obtained with WX-118 exposed on a UV-3 Micralign projection aligner.

Citation Download Citation

W. F. Cordes, III and R. F. Leonard "Resist Materials For High Resolution Photolithography", Proc. SPIE 0275, Semiconductor Microlithography VI, (28 July 1981); https://doi.org/10.1117/12.931888

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