Cluster-assembled materials: a new class of nanostructured materials with original structures and properties

A. Perez; P. Melinon; V. Dupuis; J. Tuaillon; Brigitte Prevel; M. Pellarin; J. L. Vialle; Michel Broyer

doi:10.1117/12.237051

26 April 1996 Cluster-assembled materials: a new class of nanostructured materials with original structures and properties

A. Perez, P. Melinon, V. Dupuis, J. Tuaillon, Brigitte Prevel, M. Pellarin, J. L. Vialle, Michel Broyer

Author Affiliations +

Proceedings Volume 2779, 3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials; (1996) https://doi.org/10.1117/12.237051
Event: 3rd International Conference on Intelligent Materials, 1996, Lyon, France

Abstract

The low energy cluster beam deposition technique (LECBD) is used to produce nanostructured materials with original structures and properties. In this technique, clusters do not fragment upon impact on the substrate leading to the formation of granular films by nearly random stacking of incident clusters. Both nanostructured films and films of clusters embedded in various matrices are produced using this technique. The production and deposition of controlled size distributions of free clusters are briefly described as well as the specific nucleation and growth process characteristic of the LECBD. In the second part of the paper are presented some characteristic examples of novel materials prepared by this technique. The formation and properties of films of covalent materials (C, Si) and metallic materials (Fe, Co, Ni) are presented to emphasize the memory effect of the free cluster structure in the first case and the effect of the nanocrystalline film structure through the magnetic properties in the second case.

Citation Download Citation

A. Perez, P. Melinon, V. Dupuis, J. Tuaillon, Brigitte Prevel, M. Pellarin, J. L. Vialle, and Michel Broyer "Cluster-assembled materials: a new class of nanostructured materials with original structures and properties", Proc. SPIE 2779, 3rd International Conference on Intelligent Materials and 3rd European Conference on Smart Structures and Materials, (26 April 1996); https://doi.org/10.1117/12.237051

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