Polyimide films prepared by electrophoretic deposition and their dielectric breakdown

Shuhei Nakamura; Kazuo Iida; Goro Sawa

doi:10.1117/12.238126

8 April 1996 Polyimide films prepared by electrophoretic deposition and their dielectric breakdown

Shuhei Nakamura, Kazuo Iida, Goro Sawa

Proceedings Volume 2780, Metal/Nonmetal Microsystems: Physics, Technology, and Applications; (1996) https://doi.org/10.1117/12.238126
Event: Metal/Nonmetal Microsystems: Physics, Technology, and Applications, 1995, Polanica Zdroj, Poland

Abstract

Electrophoretic deposition from non aqueous emulsion is one of the useful methods for forming polymer thin films selectively on metal electrodes. It has a potential to be used for forming an interdigital electrode for multilayer capacitor or actuator. A heat resistant polymer, polyimide (PI), film was prepared by the electrophoretic deposition method. Conductivity and dielectric strength were measured, comparing with casting and conventional PI films.

Citation Download Citation

Shuhei Nakamura, Kazuo Iida, and Goro Sawa "Polyimide films prepared by electrophoretic deposition and their dielectric breakdown", Proc. SPIE 2780, Metal/Nonmetal Microsystems: Physics, Technology, and Applications, (8 April 1996); https://doi.org/10.1117/12.238126

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