Critical issues for the application of integrated MEMS/CMOS technologies to inertial measurement units

James H. Smith; Stephen Montague; James J. Allen; J. R. Ellis; Scott M. Burgett

doi:10.1117/12.276613

19 June 1997 Critical issues for the application of integrated MEMS/CMOS technologies to inertial measurement units

James H. Smith, Stephen Montague, James J. Allen, J. R. Ellis, Scott M. Burgett

Proceedings Volume 3046, Smart Structures and Materials 1997: Smart Electronics and MEMS; (1997) https://doi.org/10.1117/12.276613
Event: Smart Structures and Materials '97, 1997, San Diego, CA, United States

Abstract

One of the principal applications of monolithically integrated micromechanical/microelectronic systems has been accelerometers for automotive applications. As integrated MEMS/CMOS technologies such as those developed by U.C. Berkeley, Analog Devices, and Sandia National Laboratories mature, additional systems for more sensitive inertial measurements will enter the commercial marketplace. In this paper, we will examine the key technology design rules which impact the performance and cost of inertial measurement devices manufactured in integrated MEMS/CMOS technologies. These design parameters include: (1) Minimum MEMS feature size, (2) Minimum CMOS feature size, (3) Maximum MEMS linear dimension, (4) Number of mechanical MEMS layers, and (5) MEMS/CMOS spacing. In particular, the embedded approach to integration developed at Sandia will be examined in the context of these technology features. Presently, this technology offers MEMS feature sizes as small as 1 micrometers , CMOS critical dimensions of 1.25 micrometers , MEMS linear dimensions of 1000 micrometers , a single mechanical level of polysilicon, and a 100 micrometers space between MEMS and CMOS.

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James H. Smith, Stephen Montague, James J. Allen, J. R. Ellis, and Scott M. Burgett "Critical issues for the application of integrated MEMS/CMOS technologies to inertial measurement units", Proc. SPIE 3046, Smart Structures and Materials 1997: Smart Electronics and MEMS, (19 June 1997); https://doi.org/10.1117/12.276613

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