New premolded package with optical fiber guide pipe

Shigeo Tanahashi; Mitsugu Uraya; Nobuyuki Takehashi; Mitsuo Yanagisawa; Satoru Tomie

doi:10.1117/12.305475

20 April 1998 New premolded package with optical fiber guide pipe

Shigeo Tanahashi, Mitsugu Uraya, Nobuyuki Takehashi, Mitsuo Yanagisawa, Satoru Tomie

Proceedings Volume 3289, Micro-Optics Integration and Assemblies; (1998) https://doi.org/10.1117/12.305475
Event: Optoelectronics and High-Power Lasers and Applications, 1998, San Jose, CA, United States

Abstract

A new pre-molded organic package with optical fiber guide pipe has been developed to meet the demand of significant package cost reduction in subscriber systems. The new pre- molded package is composed of a new organic materia which has high anti-moisture reliability. The new pre-molded package has not degraded after reliability test including thermal shock, temperature cycling and PCT of 0 to 100C/500 cycle, -40 to 84 C/500 cycle and 121C/2atm, respectively. The new developed pre-molded package with the guide pipe can be used in the subscriber systems with low- cost effect and high reliability.

Citation Download Citation

Shigeo Tanahashi, Mitsugu Uraya, Nobuyuki Takehashi, Mitsuo Yanagisawa, and Satoru Tomie "New premolded package with optical fiber guide pipe", Proc. SPIE 3289, Micro-Optics Integration and Assemblies, (20 April 1998); https://doi.org/10.1117/12.305475

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