Paper
5 June 1998 Highly accurate stitching method between cell projection and variably shaped e-beam shots
Yoshikatsu Kojima, Naka Onoda, Kenichi Tokunaga, Ken Nakajima, Hiroshi Nozue
Author Affiliations +
Abstract
For development and practical fabrication of advanced ultra- large-scale integrated circuits (ULSIs), cell projection (CP) electron beam (EB) lithography has the advantage of high writing throughput, compared with conventional variably shaped (VS) EB lithography. However, when the CP method is used for fabricating advanced ULSIs, the shot stitching accuracy for the minimum feature size between CP and VS EB shots becomes a serious problem. To obtain highly reliable shot stitching accuracy between CP and VS EB shots, we developed a highly accurate stitching method using a cross- correlation method for measurement of the CP EB shot center position. By using the cross-correlation method between ideal and practical detected signals, an estimation stability error of less than 10 nm for the position of the CP EB shot center was achieved. We applied this proposed method in Gbit DRAM pattern fabrication. The mean value for the EB shot stitching accuracy was always suppressed to less than 10 nm. As a result, we obtained a shot stitching accuracy of less than 25 nm between CP and VS EB shots.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Yoshikatsu Kojima, Naka Onoda, Kenichi Tokunaga, Ken Nakajima, and Hiroshi Nozue "Highly accurate stitching method between cell projection and variably shaped e-beam shots", Proc. SPIE 3331, Emerging Lithographic Technologies II, (5 June 1998); https://doi.org/10.1117/12.309602
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Signal detection

Error analysis

Electron beam lithography

Lithography

Electron beams

Integrated circuits

Semiconducting wafers

RELATED CONTENT


Back to Top