Paper
1 January 1998 Kinetics of the thermal breakdown of dielectrics
Emma Kostenko, Alexander I. Melker
Author Affiliations +
Proceedings Volume 3345, International Workshop on New Approaches to High-Tech Materials: Nondestructive Testing and Computer Simulations in Materials Science and Engineering; (1998) https://doi.org/10.1117/12.299594
Event: International Workshop on New Approaches to High Tech Materials: Nondestructive Testing and Computer Simulations in Materials Science and Engineering, 1997, St. Petersburg, Russian Federation
Abstract
The kinetics of thermal breakdown of a dielectric is investigated by the computer simulation method using the 2D model of a dielectric with heterogeneous structure. The material is assumed to be placed in an external homogeneous electric field and is divided into the cells of different local electric field strength. The output, redistribution, and dissipation of heat from the cells are taken into consideration. It is supported that overheating of a cell leads to its destruction, and the breakdown takes place when two electrodes are joined together by a continuous chain of damaged cells. The correlation between the damage kinetics and the dependence of the average temperature of a dielectric on time is found. The equation connecting the breakdown time, material properties, and operating conditions is suggested.
© (1998) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Emma Kostenko and Alexander I. Melker "Kinetics of the thermal breakdown of dielectrics", Proc. SPIE 3345, International Workshop on New Approaches to High-Tech Materials: Nondestructive Testing and Computer Simulations in Materials Science and Engineering, (1 January 1998); https://doi.org/10.1117/12.299594
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Dielectrics

Computer simulations

Thulium

Electrodes

Astatine

Optical spheres

Beryllium

Back to Top