Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing

Dale L. Hetherington; Jeffry J. Sniegowski

doi:10.1117/12.326692

13 October 1998 Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing

Dale L. Hetherington, Jeffry J. Sniegowski

Proceedings Volume 3440, Photonics for Space Environments VI; (1998) https://doi.org/10.1117/12.326692
Event: SPIE's International Symposium on Optical Science, Engineering, and Instrumentation, 1998, San Diego, CA, United States

Abstract

Surface polysilicon micromachined micromirrors require ultra-flat surfaces for advance optical applications such as adaptive optics. This paper details the planarization of micromirrors using chemical-mechanical polishing. We show that the increase in topography is due to a high temperature anneal step downstream for the CMP process itself. Two process alternatives were investigated: (1) perform a CMP step after the high temperature anneal step, and (2) perform a CMP step on a final polysilicon mirror surface. Both process alternatives produced acceptable flatness requirements for micromirror applications.

Citation Download Citation

Dale L. Hetherington and Jeffry J. Sniegowski "Improved polysilicon surface-micromachined micromirror devices using chemical-mechanical polishing", Proc. SPIE 3440, Photonics for Space Environments VI, (13 October 1998); https://doi.org/10.1117/12.326692

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