SVG 8800 photoresist coater uniformity improvement using Shipley resist 3010

Deborah Emielita

doi:10.1117/12.324337

3 September 1998 SVG 8800 photoresist coater uniformity improvement using Shipley resist 3010

Deborah Emielita

Proceedings Volume 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV; (1998) https://doi.org/10.1117/12.324337
Event: Microelectronic Manufacturing, 1998, Santa Clara, CA, United States

Abstract

This article presents a methodology used to obtain nearly identical photoresist thickness and uniformity results from four SVG 8800 coat tracks. The intent was to investigate the impact of equipment deviations on the resist thickness mean. The before-and-after paired comparison experimental design is the method of investigation used. Evaluation techniques include extensive use of the T-test to check the effect of the experiments upon thickness means. Variables in this study include: softbake temperature, cast spin sped, exhaust flow, two spin chuck types, resists sit time in the pump, arm retraction time, and resist dispense temperature. The sample sizes were sets of three to ten wafers per group. The most significant variable found was the arm retraction time. Any delay evaporated the solvent from the resist prior to the cast step resulting in a thicker measurement. Software modification to the arm program eliminated this effect. Additional findings include the effects of resist dispense temperature, resist sit time in the pump and type of spin chuck. A decrease in temperature lowers the resist thickness. Excessive sit time results in thinner resist values and a non-normal distribution of thickness. One chick type had slightly thicker resist values and more variation in thickness.

Citation Download Citation

Deborah Emielita "SVG 8800 photoresist coater uniformity improvement using Shipley resist 3010", Proc. SPIE 3507, Process, Equipment, and Materials Control in Integrated Circuit Manufacturing IV, (3 September 1998); https://doi.org/10.1117/12.324337

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