Mechanical impedance measurements for improved cost-effective process monitoring

Caroline R. Clopet; Deborah A. Pullen; Rodney Alan Badcock; Brian Ralph; Gerard Franklyn Fernando; Steve W. Mahon

doi:10.1117/12.350742

9 June 1999 Mechanical impedance measurements for improved cost-effective process monitoring

Caroline R. Clopet, Deborah A. Pullen, Rodney Alan Badcock, Brian Ralph, Gerard Franklyn Fernando, Steve W. Mahon

Proceedings Volume 3668, Smart Structures and Materials 1999: Smart Structures and Integrated Systems; (1999) https://doi.org/10.1117/12.350742
Event: 1999 Symposium on Smart Structures and Materials, 1999, Newport Beach, CA, United States

Abstract

The aerospace industry has seen a considerably growth in composite usage over the past ten years, especially with the development of cost effective manufacturing techniques such as Resin Transfer Molding and Resin Infusion under Flexible Tooling. The relatively high cost of raw material and conservative processing schedules has limited their growth further in non-aerospace technologies. In-situ process monitoring has been explored for some time as a means to improving the cost efficiency of manufacturing with dielectric spectroscopy and optical fiber sensors being the two primary techniques developed to date. A new emerging technique is discussed here making use of piezoelectric wafers with the ability to sense not only aspects of resin flow but also to detect the change in properties of the resin as it cures. Experimental investigations to date have shown a correlation between mechanical impedance measurements and the mechanical properties of cured epoxy systems with potential for full process monitoring.

Citation Download Citation

Caroline R. Clopet, Deborah A. Pullen, Rodney Alan Badcock, Brian Ralph, Gerard Franklyn Fernando, and Steve W. Mahon "Mechanical impedance measurements for improved cost-effective process monitoring", Proc. SPIE 3668, Smart Structures and Materials 1999: Smart Structures and Integrated Systems, (9 June 1999); https://doi.org/10.1117/12.350742

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