Compact and simple ESPI devices for testing of materials and components in microelectronic manufacturing

Valery Petrov; Robert Denker; Bernhard Lau

doi:10.1117/12.346912

27 April 1999 Compact and simple ESPI devices for testing of materials and components in microelectronic manufacturing

Valery Petrov, Robert Denker, Bernhard Lau

Proceedings Volume 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing; (1999) https://doi.org/10.1117/12.346912
Event: Microelectronic Manufacturing Technologies, 1999, Edinburgh, United Kingdom

Abstract

With the increasing packaging density of electronic components in the integrated circuits (IC) as well as on the printed circuit boards the problems with heat dissipation also increase. Electronic speckle pattern interferometry (ESPI) is a rapidly developing optoelectronic method of nondestructive laser metrology supported with computer evaluations. It permits measurements of deformations in the micrometer and submicrometer ranges produced by an electrical signal, heating, mechanical stress or another load. Though these method seems very friendly for testing microelectronic components, composite materials, miniature devices, circuit boards, wafers etc., it has several drawbacks which prevent its application in real industrial environment: complexity, bulkiness and high costs of optical setups, difficulties in aligning of the optical elements. There are problems in working outside the laboratory especially due to high sensitivity of ESPI devices against environmental vibrations and daylight. We present several methods ESPI based on which a family of devices was built. Their unique properties permit to avoid all drawbacks mentioned above. These devices are extremely simple and compact. They are easily aligned and operated even by persons who are not skilled in optics. These devices are ideally suited for working outside the laboratory even by persons who are not skilled in optics. These devices are ideally suited for working outside the laboratory for example in a well-lit industrial environment. The innovative devices permit to measure deformations both in the plane of the object surface and perpendicular to it. A detailed description of the methods and devices given. Multiple examples of ESPI computer evaluations obtained in the novel devices with different small objects under test are presented. However these devices permit to work with much bigger objects if required. Our methods and devices are also suited for qualitative as well as quantitative analysis.

Citation Download Citation

Valery Petrov, Robert Denker, and Bernhard Lau "Compact and simple ESPI devices for testing of materials and components in microelectronic manufacturing", Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); https://doi.org/10.1117/12.346912

ACCESS THE FULL ARTICLE

INSTITUTIONAL
Select your institution to access the SPIE Digital Library.

SELECT YOUR INSTITUTION

PERSONAL
Sign in with your SPIE account to access your personal subscriptions or to use specific features such as save to my library, sign up for alerts, save searches, etc.

PERSONAL SIGN IN

No SPIE Account? Create one

PURCHASE THIS CONTENT

SUBSCRIBE TO DIGITAL LIBRARY

50 downloads per 1-year subscription

Members: $195

Non-members: $335 ADD TO CART

25 downloads per 1 - year subscription

Members: $145

Non-members: $250 ADD TO CART

PURCHASE SINGLE ARTICLE

Includes PDF, HTML & Video, when available