Theoretical and practical aspects of remote temperature measurement in semiconductor manufacturing

Evgeny Glazman; A. Glazman; Assaf Thon

doi:10.1117/12.346914

27 April 1999 Theoretical and practical aspects of remote temperature measurement in semiconductor manufacturing

Evgeny Glazman, A. Glazman, Assaf Thon

Proceedings Volume 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing; (1999) https://doi.org/10.1117/12.346914
Event: Microelectronic Manufacturing Technologies, 1999, Edinburgh, United Kingdom

Abstract

The general principles of operation of passive and active pyrometry methods are considered. The usefulness of ratio, multi-ratio, approximation, and enhanced emissivity methods to unknown and changing emissivity situations is analyzed. A spectral functional for the emissivity is postulated to give the theoretical limit of accuracy of any passive method. A novel passive-active method, with accuracy better than 1 percent, for semiconductor wafer measurement is described and demonstrated through on-line measurement in Rapid Thermal Chemical Vapor Deposition process.

Citation Download Citation

Evgeny Glazman, A. Glazman, and Assaf Thon "Theoretical and practical aspects of remote temperature measurement in semiconductor manufacturing", Proc. SPIE 3743, In-Line Characterization, Yield Reliability, and Failure Analyses in Microelectronic Manufacturing, (27 April 1999); https://doi.org/10.1117/12.346914

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