Modifications of DLC films for MEMS applications

Franklin Chau-Nan Hong; Yoou-Bin Guo; Jiun-Yao Wang

doi:10.1117/12.360463

3 September 1999 Modifications of DLC films for MEMS applications

Franklin Chau-Nan Hong, Yoou-Bin Guo, Jiun-Yao Wang

Proceedings Volume 3875, Materials and Device Characterization in Micromachining II; (1999) https://doi.org/10.1117/12.360463
Event: Symposium on Micromachining and Microfabrication, 1999, Santa Clara, CA, United States

Abstract

SiO_x-containing DLC films are deposited by plasma enhanced chemical vapor deposition on Si substrate. The effect of SiO_x dopants on the stress, adhesion and hydrophobicity of the DLC films are studied. The incorporation of SiO_x in the DLC films deposited by using hexamethyldisiloxane and CH₄ mixture reduces the residual stress as well as enhances adhesion of the film on the substrate. Besides, the thermal stability of the film also improves.

Citation Download Citation

Franklin Chau-Nan Hong, Yoou-Bin Guo, and Jiun-Yao Wang "Modifications of DLC films for MEMS applications", Proc. SPIE 3875, Materials and Device Characterization in Micromachining II, (3 September 1999); https://doi.org/10.1117/12.360463

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