Paper
10 April 2000 New ultrathin 3D integration technique: technological and thermal investigations
Stephane Pinel, Josiane Tasselli, Antoine Marty, Jean-Pierre Bailbe, Eric Beyne, Rita Van Hoof, Santiago Marco, Sergio Leseduarte, Olivier Vendier, Augustin Coello-Vera
Author Affiliations +
Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382262
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
A new vertical chip integration is proposed, based on the UTCS concept. It consists in stacking thinned chips on top of a silicon substrate. Lateral and vertical metal interconnections and the thinned chips are embedded in BCB layers. This wafer scale integration technique is presented. Thermal behavior of such stacked structure is also discussed.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Stephane Pinel, Josiane Tasselli, Antoine Marty, Jean-Pierre Bailbe, Eric Beyne, Rita Van Hoof, Santiago Marco, Sergio Leseduarte, Olivier Vendier, and Augustin Coello-Vera "New ultrathin 3D integration technique: technological and thermal investigations", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); https://doi.org/10.1117/12.382262
Lens.org Logo
CITATIONS
Cited by 3 scholarly publications.
Advertisement
Advertisement
RIGHTS & PERMISSIONS
Get copyright permission  Get copyright permission on Copyright Marketplace
KEYWORDS
Copper

Silicon

Dielectrics

Glasses

Metals

Raman spectroscopy

3D modeling

RELATED CONTENT

Fabrication of plasmonic waveguides for device applications
Proceedings of SPIE (September 28 2007)
Near-field spectroscopy of nanostructures
Proceedings of SPIE (April 29 2010)
UV laser-assisted wire stripping and micro-machining
Proceedings of SPIE (February 01 1994)
Rapid integrated circuit delayering without grass
Proceedings of SPIE (September 12 1996)

Back to Top