Paper
10 April 2000 Silicon micro-electro-mechanical systems for millimeter-wave applications
Katia M. Grenier, Patrick Pons, T. Parra, Robert Plana, Jacques Graffeuil
Author Affiliations +
Proceedings Volume 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS; (2000) https://doi.org/10.1117/12.382269
Event: Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, 2000, Paris, France
Abstract
A new fully silicon MEM technology and design methodology is introduced to realize millimeter-wave applications such as switches. It is based on two kinds of micro-machining techniques: a bulk micro-machines used to realize micro-wave circuits on a suspended membrane in order to decrease losses, and a surface micro-machining to make air-bridges actuable by electrostatic force. A MEM bridge electrical model has been investigated and implemented in the design of distributed switches.
© (2000) COPYRIGHT Society of Photo-Optical Instrumentation Engineers (SPIE). Downloading of the abstract is permitted for personal use only.
Katia M. Grenier, Patrick Pons, T. Parra, Robert Plana, and Jacques Graffeuil "Silicon micro-electro-mechanical systems for millimeter-wave applications", Proc. SPIE 4019, Design, Test, Integration, and Packaging of MEMS/MOEMS, (10 April 2000); https://doi.org/10.1117/12.382269
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KEYWORDS
Bridges

Switches

Microelectromechanical systems

Micromachining

Silicon

Microwave radiation

Photoresist materials

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